Eng Huat Eh Goh

Title: Eng Huat Eh Goh: Innovator in Integrated Circuit Technology

Introduction

Eng Huat Eh Goh is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of advanced circuit packages that enhance the performance and efficiency of electronic devices.

Latest Patents

Eng Huat Eh Goh holds a patent for integrated circuit packages. The patent describes substrateless integrated circuit (IC) packages featuring a die with direct diagonal connections. This invention includes various structures, devices, and methods that improve the functionality of IC packages. For instance, the IC package may consist of a die with multiple contacts, a dielectric layer in contact with the die's face, and a conductive pathway that extends diagonally through the dielectric layer. This design allows for efficient translation of contacts from dense to less dense layouts and vice versa. The dielectric layer and conductive pathway may also extend beyond the die's footprint on one or more edges, further enhancing the package's capabilities. Eng Huat Eh Goh has 1 patent to his name.

Career Highlights

Eng Huat Eh Goh is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that shape the future of electronics.

Collaborations

Eng Huat Eh Goh has collaborated with talented colleagues, including Min Suet Lim and Jiun Hann Sir. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Eng Huat Eh Goh is a distinguished inventor whose work in integrated circuit technology has made a significant impact on the electronics industry. His innovative patent and contributions at Intel Corporation highlight his dedication to advancing technology.