Company Filing History:
Years Active: 2016
Title: Eng Cheng Chng: Innovator in Semiconductor Device Encapsulation
Introduction
Eng Cheng Chng is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor device encapsulation. With a focus on enhancing manufacturing processes, he has developed innovative solutions that address industry challenges.
Latest Patents
Eng Cheng Chng holds a patent for an "Apparatus for electroplating a tooling for use in semiconductor device encapsulation." This apparatus is designed to electroplate the inside wall of a transfer mold, which is essential for semiconductor device encapsulation. The invention features a fixture with a through-hole that accommodates an electrode, allowing for a secure fit that facilitates the electroplating process. This innovation significantly improves the efficiency and effectiveness of semiconductor manufacturing.
Career Highlights
Eng Cheng Chng is currently employed at Asm Technology Singapore Pte Ltd, where he applies his expertise in semiconductor technology. His work has contributed to advancements in the industry, particularly in the area of device encapsulation.
Collaborations
Eng Cheng Chng has collaborated with talented colleagues, including Shu Chuen Ho and Kai Fat Yip, to further enhance the development of innovative technologies in their field.
Conclusion
Eng Cheng Chng's contributions to semiconductor device encapsulation through his patented apparatus exemplify his commitment to innovation. His work continues to influence the industry positively, showcasing the importance of inventive solutions in technology.