The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jul. 18, 2011
Shu Chuen Ho, Singapore, SG;
Kai Fat Yip, Singapore, SG;
Eng Cheng Chng, Singapore, SG;
Yew Lan Ngo, Singapore, SG;
Saravana Ranganathan Damodaran, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Kai Fat Yip, Singapore, SG;
Eng Cheng Chng, Singapore, SG;
Yew Lan Ngo, Singapore, SG;
Saravana Ranganathan Damodaran, Singapore, SG;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.