Company Filing History:
Years Active: 2019-2023
Title: En-Shao Liu: Innovator in Microelectronics
Introduction
En-Shao Liu is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 6 patents. His work focuses on enhancing the performance and efficiency of integrated circuits.
Latest Patents
One of Liu's latest patents is titled "Variable pitch and stack height for high performance interconnects." This patent describes an integrated circuit structure that includes a base and multiple metal levels. The first metal level features a first dielectric material and a first plurality of interconnect lines with variable widths and heights. This innovative design allows for improved performance by optimizing the dimensions of the interconnect lines.
Another notable patent is "Transistor with an airgap spacer adjacent to a transistor gate." This invention involves a microelectronic transistor that incorporates an airgap spacer as a gate sidewall spacer. The airgap spacer minimizes capacitive coupling between the gate electrode and the source or drain contacts, which can significantly reduce circuit delay, enhancing the overall efficiency of the microelectronic transistor.
Career Highlights
En-Shao Liu is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has positioned him as a key player in the development of cutting-edge microelectronic technologies.
Collaborations
Throughout his career, Liu has collaborated with notable colleagues, including Chen-Guan Lee and Joodong Park. These collaborations have contributed to the advancement of innovative solutions in the field of microelectronics.
Conclusion
En-Shao Liu's contributions to microelectronics through his patents and work at Intel Corporation highlight his role as a significant innovator in the industry. His inventions continue to push the boundaries of technology, paving the way for future advancements in integrated circuits.