Emiel De Bruin

Title: Emiel De Bruin: Innovator in Semiconductor Technology

Introduction

Emiel De Bruin is a notable inventor based in Elst, Netherlands. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods and devices that enhance the efficiency and functionality of semiconductor applications.

Latest Patents

Among his latest patents is the "Die substrate assembly and method." This invention involves a die made of semiconductor material, designed to receive a solder layer of a gold-containing alloy for die bonding to a substrate. The die features an interface layer on its surface, which consists of multiple sub-layers of different metals to improve performance. Another significant patent is the "Discrete semiconductor device package and manufacturing method." This patent describes a discrete semiconductor device package that includes a semiconductor die with a conductive body and encapsulation material, along with a capping member in conductive contact with the solder portion. This innovation aims to streamline the manufacturing process of semiconductor devices.

Career Highlights

Emiel De Bruin has worked with prominent companies in the semiconductor industry, including NXP B.V. and Ampleon Netherlands B.V. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Emiel has collaborated with talented individuals such as Jan Van Kempen and René Wilhelmus Johannes Maria Van Den Boomen. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Emiel De Bruin's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor applications.