The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
May. 08, 2013
Nxp B.v., Eindhoven, NL;
Tim Boettcher, Lauenbrueck, DE;
Sven Walczyk, Waalre, NL;
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Rolf Brenner, Hamburg, DE;
Emiel De Bruin, Elst, NL;
NXP B.V., Eindhoven, NL;
Abstract
Disclosed is a discrete semiconductor device package () comprising a semiconductor die () having a first surface and a second surface opposite said first surface carrying a contact (); a conductive body () on said contact; an encapsulation material () laterally encapsulating said conductive body; and a capping member () such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap () may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.