Emanual I Cooper

Title: Emanual I Cooper: Innovator in Lead-Free Interconnect Technology

Introduction

Emanual I Cooper is a notable inventor based in Scarsdale, NY (US). He has made significant contributions to the field of electronic components, particularly in the area of lead-free interconnects. His innovative approach has led to advancements that enhance the fabrication processes of semiconductor wafers.

Latest Patents

Emanual I Cooper holds a patent titled "Inhibition of tin oxide formation in lead free interconnect formation." This patent describes a method for removing exposed seed layers during the fabrication of solder interconnects on electronic components. The process ensures that the interconnects and the underlying wafer substrate remain undamaged, resulting in a high wafer yield. The method utilizes an oxalic acid solution to inhibit the formation of tin compounds on the barrier layer surface, which can lead to incomplete barrier layer removal and potential shorts.

Career Highlights

Emanual I Cooper is associated with International Business Machines Corporation (IBM), where he has applied his expertise in semiconductor technology. His work has been instrumental in developing lead-free solder interconnects, which are crucial for modern electronic devices. His innovative methods contribute to the efficiency and reliability of electronic components.

Collaborations

Emanual has collaborated with notable colleagues such as John Michael Cotte and Lisa A Fanti. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Emanual I Cooper's contributions to the field of lead-free interconnect technology exemplify his commitment to advancing electronic component fabrication. His innovative patent and collaborative efforts highlight his role as a key figure in the industry.