Eliav Shaul

Title: Eliav Shaul: Innovator in Microelectronic Assemblies

Introduction

Eliav Shaul is a prominent inventor based in Hosen, Israel. He has made significant contributions to the field of microelectronics, particularly in the development of innovative assembly techniques. His work focuses on enhancing the functionality and efficiency of microelectronic devices.

Latest Patents

Eliav Shaul holds a patent for "Microelectronic assemblies having front end under embedded radio frequency die." This patent describes microelectronic assemblies and related devices and methods. In some embodiments, a microelectronic assembly may include a package substrate with a first surface and an opposing second surface. The assembly features a radio frequency (RF) die embedded in the package substrate, with a plurality of contacts facing towards the second surface. An RF front end is positioned under the RF die, ensuring it does not extend beyond the lateral surface area of the RF die. This innovative design enhances the performance of microelectronic devices.

Career Highlights

Eliav Shaul is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel allows him to work on cutting-edge technologies that shape the future of microelectronics.

Collaborations

Eliav collaborates with Avi Tsarfati, a fellow innovator in the field. Their partnership fosters creativity and innovation, leading to advancements in microelectronic technologies.

Conclusion

Eliav Shaul's contributions to microelectronic assemblies demonstrate his commitment to innovation in technology. His patent and work at Intel Corporation highlight his role as a key player in the advancement of microelectronics.