Calamba, Philippines

Ela Mia Cadag

This inventor holds 22 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Stmicroelectronics Gmbh. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ela Mia Cadag. Retrieved from https://idiyas.com/inventor/ela-mia-cadag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 37(Granted Patents)


Location History:

  • Laguna, PH (2015 - 2017)
  • Calamba, PH (2016 - 2024)

Company Filing History:


Years Active: 2015-2025

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Areas of Expertise:
Leadless Package
Semiconductor Device
Modified Leadframe
Electromagnetic Shielding
Integrated Circuit
Solder Wettable
Adhesive Overflow
Heatsink Integration
Conductive Clip
Wire Die Attach
Tapeless Leadframe
Molding Process
22 patents (USPTO):Explore Patents

Title: Ela Mia Cadag: Innovator in Semiconductor Packaging

Introduction

Ela Mia Cadag, based in Calamba, Philippines, is a remarkable inventor known for his contributions to semiconductor packaging. With a total of 21 patents to his name, Cadag’s work has significantly impacted the field of electronics, particularly in enhancing the performance and reliability of semiconductor devices.

Latest Patents

Among his latest patents, Cadag has developed a technology for lead stabilization in semiconductor packages. This innovation focuses on semiconductor packages that include a plurality of leads, comprising active leads that are electrically coupled to bond pads of a semiconductor die and inactive leads that are not. The active leads form lands exposed at the lower surface of the package while the inactive ones remain hidden, which aids in improving the overall functionality and stability of the package.

Another noteworthy patent involves a method for manufacturing leadless semiconductor packages with wettable flanks. This design ensures improved solder fillet formation during the mounting of the leadless packages onto substrates. The solder fillets are not only reliably formed but also easily detected by automated optical inspection (AOI) systems, thereby enhancing quality assurance in the production process.

Career Highlights

Cadag currently works at STMicroelectronics GmbH, a leading company in the semiconductor industry where he applies his innovative ideas and technical skills. His role has allowed him to focus on cutting-edge research and development in semiconductor technologies, contributing to the advancement of modern electronics.

Collaborations

Throughout his career, Cadag has collaborated with colleagues such as Aaron Cadag and Jefferson Sismundo Talledo. These collaborations highlight the importance of teamwork in driving innovation within the semiconductor field, as they work together to tackle complex challenges and develop novel solutions.

Conclusion

Ela Mia Cadag has made significant strides in the semiconductor industry through his inventive spirit and technical prowess. With multiple patents that focus on improving semiconductor packaging, he continues to be a vital player in shaping the future of electronics. His work not only reflects his expertise but also serves as an inspiration for aspiring inventors in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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