Eitaro Morimoto

Title: Eitaro Morimoto: Innovator in Electronic Component Manufacturing

Introduction

Eitaro Morimoto is a notable inventor based in Kome, Japan. He has made significant contributions to the field of electronic component manufacturing, holding three patents that showcase his innovative approach to technology.

Latest Patents

One of Morimoto's latest patents is an electronic component manufacturing method that includes a step of embedding a metal film. This invention provides a method that involves depositing a barrier layer containing titanium nitride on an object with a concave part. It also includes a step of filling a low-melting-point metal directly on the barrier layer using a PCM sputtering method while forming a magnetic field with magnets arranged in a polygonal grid. Another significant patent is a method and apparatus for manufacturing semiconductor devices. This invention utilizes a PVD method to achieve a desired effective work function and reduce leak current without increasing the equivalent oxide thickness. The process involves preparing a substrate with an insulating film and depositing a metal nitride film using a sputtering deposition technique.

Career Highlights

Eitaro Morimoto is currently employed at Canon Anelva Corporation, where he continues to develop innovative technologies in semiconductor manufacturing. His work has been instrumental in advancing methods that enhance the efficiency and effectiveness of electronic components.

Collaborations

Morimoto has collaborated with notable coworkers, including Takuya Seino and Akira Matsuo, contributing to various projects that push the boundaries of technology in their field.

Conclusion

Eitaro Morimoto's contributions to electronic component manufacturing through his patents and work at Canon Anelva Corporation highlight his role as a key innovator in the industry. His inventions are paving the way for advancements in semiconductor technology.