The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Jun. 20, 2011
Shunichi Wakayanagi, Hino, JP;
Takayuki Saito, Kawasaki, JP;
Takuya Seino, Kawasaki, JP;
Akira Matsuo, Kawasaki, JP;
Koji Yamazaki, Tokyo, JP;
Eitaro Morimoto, Kome, JP;
Yohsuke Shibuya, Isehara, JP;
Yu Sato, Fiuchu, JP;
Naomu Kitano, Machida, JP;
Shunichi Wakayanagi, Hino, JP;
Takayuki Saito, Kawasaki, JP;
Takuya Seino, Kawasaki, JP;
Akira Matsuo, Kawasaki, JP;
Koji Yamazaki, Tokyo, JP;
Eitaro Morimoto, Kome, JP;
Yohsuke Shibuya, Isehara, JP;
Yu Sato, Fiuchu, JP;
Naomu Kitano, Machida, JP;
Canon Anelva Corporation, Kawasaki-shi, JP;
Abstract
The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.