Okaya, Japan

Eiji Yoshimura

This inventor holds 3 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Daiwa Co., Ltd., Daiwa Corporation, Ltd.. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiji Yoshimura. Retrieved from https://idiyas.com/inventor/eiji-yoshimura-b2pk5fjp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7


Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2003-2026

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3 patents (USPTO):Explore Patents

Title: Eiji Yoshimura: Innovator in Multilayer Wiring Board Technology

Introduction

Eiji Yoshimura is a notable inventor based in Okaya, Japan. He has made significant contributions to the field of electronics, particularly in the manufacturing of multilayer wiring boards. With a total of two patents to his name, Yoshimura's work showcases innovative methods that enhance the reliability and efficiency of electronic components.

Latest Patents

Yoshimura's latest patents focus on methods of manufacturing multilayer wiring boards. The first patent describes a process that includes forming an upper wiring layer that is electrically connected to a pillar-shaped metallic body. This method emphasizes the use of simple equipment and conventional steps to create fine wiring layers while ensuring high reliability. The second patent further elaborates on the manufacturing process, detailing the steps involved in forming a column-like metallic body on a lower wiring layer. This method allows for the creation of a conductive layer and a plating layer, ultimately leading to a uniform height for the metallic body in a cost-effective manner.

Career Highlights

Eiji Yoshimura is associated with Daiwa Co., Ltd., where he applies his expertise in electronics and manufacturing. His innovative approaches have positioned him as a key figure in the development of advanced wiring technologies. His patents reflect a commitment to improving manufacturing processes and enhancing product reliability.

Collaborations

Yoshimura has worked alongside Toshiro Higuchi, contributing to the advancement of multilayer wiring board technology. Their collaboration has fostered an environment of innovation and creativity within their field.

Conclusion

Eiji Yoshimura's contributions to multilayer wiring board technology demonstrate his dedication to innovation in electronics. His patents not only improve manufacturing processes but also enhance the reliability of electronic components. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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