The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Aug. 31, 2001
Eiji Yoshimura, Okaya, JP;
Toshiro Higuchi, Yokohama, JP;
Daiwa Co., Ltd., Nagano, JP;
Abstract
A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer ( ), a part thereof being electrically connected to a pillar-shaped metallic body ( ), after he pillar-shaped metal body ( ) is formed on a lower wiring layer ( ) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer ( ) constituting the metallic body, a sub-step of forming a mask layer ( ) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine. Moreover, a multilayer wiring board having a high reliability can be manufactured,