Location History:
- Osaka, All of, JP (1985)
- Osaka, JP (1985 - 1986)
Company Filing History:
2 out of 33 
2 out of 342 
1 out of 327 Years Active: 1985-1986
Title: Eiji Watanabe: Innovator in Electroplating and Paper Sizing Technologies
Introduction
Eiji Watanabe is a notable inventor based in Osaka, Japan. He has made significant contributions to the fields of electroplating and paper sizing, holding a total of 4 patents. His innovative approaches have led to advancements in material science and manufacturing processes.
Latest Patents
Watanabe's latest patents include a process for preparing improved Zn-Ni-alloy electroplated steel sheets. This method involves electroplating steel sheets with an acid electroplating bath containing zinc ions, nickel ions, and a small amount of titanium ions. The process is enhanced by pre-electroplating with a bath rich in nickel ions and subsequently heating the plating sheet in the presence of water. Another significant patent is for a method of sizing paper, which introduces an internal sizing agent that produces an excellent sizing effect. This agent can be utilized in neutral to alkaline environments without the need for traditional fixing agents like aluminum sulfate. The sizing agent is derived from a specific reaction product of maleic anhydride and branched internal olefins.
Career Highlights
Throughout his career, Watanabe has worked with prominent companies such as Arakawa Chemical Industries and Nisshin Steel Co., Ltd. His work in these organizations has allowed him to develop and refine his innovative technologies.
Collaborations
Watanabe has collaborated with notable coworkers, including Kimio Kawatani and Takashi Fujikawa. Their combined expertise has contributed to the successful development of various projects and patents.
Conclusion
Eiji Watanabe's contributions to electroplating and paper sizing technologies highlight his role as an influential inventor. His innovative patents continue to impact the manufacturing industry positively.