Edwin J Adlam

Title: Edwin J Adlam: Innovator in Multi-Layer Circuit Board Technology

Introduction

Edwin J Adlam is a notable inventor based in Singapore, recognized for his contributions to the field of circuit board technology. He holds a patent that significantly enhances the manufacturing process of multi-layer circuit boards. His innovative approach addresses critical challenges in the adhesion of copper foil to resin-impregnated substrates.

Latest Patents

Adlam's patent, titled "Method for making multi-layer circuit boards," introduces a bond enhancement process that promotes strong and stable adhesive bonds between copper foil surfaces and adjacent resin-impregnated substrates. The process involves treating a black oxide-coated copper surface with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide. This treatment converts the black oxide coating into a roughened metallic copper coating, which is then passivated and laminated to a resin-impregnated substrate. This method is particularly beneficial in multilayer printed circuit fabrication, ensuring that inner-layer laminates are resistant to pink-ring formation and stable under thermal and mechanical stresses.

Career Highlights

Edwin J Adlam is currently associated with Park Electrochemical Corporation, where he continues to innovate in the field of circuit board technology. His work has had a significant impact on the manufacturing processes used in the electronics industry.

Collaborations

Throughout his career, Adlam has collaborated with talented individuals such as Sukianto Rusli and Jordan Lane Wahl. These collaborations have contributed to the advancement of technology in the field of circuit boards.

Conclusion

Edwin J Adlam's innovative methods in multi-layer circuit board technology exemplify the importance of research and development in the electronics industry. His contributions continue to influence manufacturing processes and enhance product reliability.