The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 1999
Filed:
Sep. 06, 1995
Edwin J Adlam, Singapore, SG;
Sukianto Rusli, Chandler, AZ (US);
Jordan L Wahl, Mesa, AZ (US);
Tayfun Ilercil, Phoenix, AZ (US);
Robert A Forcier, Mesa, AZ (US);
Jerome S Sallo, Scottsdale, AZ (US);
Park Electrochemical Corporation, Lake Success, NY (US);
Abstract
The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. Inner-layer laminates prepared according to the process of the invention are not susceptible to pink-ring formation, exhibit excellent resistance to chemical attack at drilled holes and sheared edges and are stable under thermal and mechanical stresses.