This inventor holds 1 USPTO granted patent. Top assignee: United Microelectronics Corp.. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2000
Title: Edward Yang - Innovator in Chemical-Mechanical Polishing Technology
Introduction
Edward Yang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing, a critical process in semiconductor manufacturing. His innovative approach has led to the development of a unique polishing pad that enhances efficiency and effectiveness in the polishing process.
Latest Patents
Edward Yang holds a patent for a chemical-mechanical polishing pad. This invention features a design that includes a plurality of annular grooves and streamline grooves, which are crafted based on hydrodynamic principles. The streamline grooves are specifically designed according to flow equations derived from source flow and vortex flow. This design allows for the uniform distribution of slurry across the polishing pad, optimizing the polishing process. The angle and depth of the streamline grooves are calculated using the boundary layer effect, resulting in an optimum structure for the polishing pad. He has 1 patent to his name.
Career Highlights
Edward Yang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on enhancing polishing technologies that are essential for the production of high-quality semiconductor devices. His contributions have been instrumental in advancing the capabilities of chemical-mechanical polishing.
Collaborations
Throughout his career, Edward has collaborated with talented individuals such as Fu-Yang Yu and Peng-Yih Peng. These collaborations have fostered innovation and have contributed to the development of advanced polishing technologies.
Conclusion
Edward Yang's innovative work in chemical-mechanical polishing technology has made a significant impact on the semiconductor industry. His patented polishing pad design exemplifies his commitment to enhancing manufacturing processes. His contributions continue to influence the field and drive advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
