San Jose, CA, United States of America

Edward William Olsen

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 1.2

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2011-2020

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4 patents (USPTO):Explore Patents

Title: Inventor Edward William Olsen: Innovations in Semiconductor Packaging

Introduction

Edward William Olsen, based in San Jose, CA, has made significant contributions to the field of semiconductor packaging with a total of four patents to his name. His work has revolutionized how integrated circuits are packaged and connected, enhancing the performance and reliability of electronic devices.

Latest Patents

Among his notable patents, one of the latest inventions is the "Exposed Solderable Heat Spreader for Flipchip Packages." This innovation involves a flipchip that incorporates a silicon die – featuring solder bumps on its circuit side – and a leadframe associated with these solder bumps. Additionally, it integrates a heat spreader on the non-circuit side of the silicon die, encapsulated by a protective material, ensuring efficient thermal management for high-performance applications.

Another significant patent is related to "Laser Drilling Encapsulated Semiconductor Die to Expose Electrical Connection Therein." This method improves integrated circuit packaging by encapsulating the semiconductor die with a non-conductive material and then employing laser drilling techniques to create access points to the electrical connections. This innovative approach enables effective routing layers, ensuring reliable connectivity in complex electronic systems.

Career Highlights

Edward William Olsen is currently employed at Linear Technology Corporation, where his expertise in semiconductor technology continues to flourish. His inventive spirit and attention to detail have positioned him as a key player in developing cutting-edge technologies that meet the demands of modern electronics.

Collaborations

Throughout his career, Edward has collaborated with notable colleagues such as Leonard Shtargot and David Roy Ng. Together, they have driven advancements in semiconductor packaging methodologies, pushing the boundaries of what is achievable in this critical area of technology.

Conclusion

In summary, Edward William Olsen's contributions to semiconductor packaging through his innovative patents have had a lasting impact on the electronics industry. His work at Linear Technology Corporation and collaborations with fellow inventors enhance the quality and performance of electronic devices, showcasing the importance of innovation in today’s technology landscape.

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