The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
May. 27, 2016
Applicant:
Linear Technology Corporation, Milpitas, CA (US);
Inventor:
Edward William Olsen, San Jose, CA (US);
Assignee:
Linear Technology Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/3142 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A flipchip may include: a silicon die having a circuit side with solder bumps and a non-circuit side; a leadframe attached to the solder bumps on the circuit side of the silicon die; a heat spreader attached to the non-circuit side of the silicon die; and encapsulation material encapsulating the silicon die, a portion of the leadframe, and all but one exterior surface of the heat spreader. The leadframe may have NiPdAu plating on the portion that is not encapsulated by the encapsulation material and no plating on the portion that is attached to the solder bumps.