Bethlehem, CT, United States of America

Edward T Donlon

This inventor holds 3 USPTO granted patents. Top assignee: Macdermid, Incorporated. Active years: 1991-1994.


% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 1991-1994

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3 patents (USPTO):Explore Patents

Title: Edward T. Donlon: Innovator in Multilayer Printed Circuit Technology

Introduction

Edward T. Donlon is a notable inventor based in Bethlehem, CT (US), recognized for his contributions to the field of multilayer printed circuits. With a total of 3 patents, Donlon has made significant advancements in the technology that underpins modern electronic devices.

Latest Patents

One of Donlon's latest patents focuses on a process for fabricating multilayer printed circuits. This innovative method aims to enhance adhesion between copper circuitry innerlayers and pre-preg layers. The process involves applying a conversion coating of copper oxide on metallic copper surfaces, which alters the topography of the underlying copper. Following this, a controlled dissolution and removal of a substantial amount of the copper oxide is performed. This technique ensures that the topographical integrity of the metallic copper is maintained while achieving excellent bonding strengths. Notably, this method reduces the incidence of pink ring formation compared to conventional processes that utilize copper oxide for adhesion promotion. Additionally, the copper ion-containing solutions resulting from this process can be economically utilized in formulating electroless copper plating baths.

Career Highlights

Edward T. Donlon is currently associated with Macdermid, Incorporated, where he continues to innovate in the field of printed circuit technology. His work has been instrumental in improving manufacturing processes and product reliability in the electronics industry.

Collaborations

Throughout his career, Donlon has collaborated with esteemed colleagues, including Gary B. Larson and Donald P. Cullen. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Edward T. Donlon's contributions to multilayer printed circuit technology exemplify the spirit of innovation in the electronics industry. His patents not only enhance manufacturing processes but also pave the way for future advancements in the field.

Profile summary based on public USPTO records.
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