For the Inventor, By the Inventor

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Waterbury, CT, United States of America

Macdermid, Incorporated

Calculating rank

USPTO Granted Patents = 136

CIPO Patents = 4

EPO Patents = 36

Trademarks = 35

Forward Citations = 2,117

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104 inventors (with patents filed for the assignee):

Peter E Kukanskis (32 out of 46 patents)

Donald R Ferrier (25 out of 33 patents)

Gary B Larson (20 out of 24 patents)

4. Raymond A Letize (12 out of 14 patents)

5. John L Cordani (12 out of 12 patents)

6. John J Grunwald (11 out of 11 patents)

7. Eric Yakobson (7 out of 7 patents)

8. John J Grunwald (6 out of 7 patents)

9. Bryan Whitmore (6 out of 6 patents)

10. Steven A Castaldi (5 out of 20 patents)

11. Jon E Bengston (5 out of 6 patents)

12. Peter D Gabriele (5 out of 5 patents)

13. Harold L Rhodenizer (5 out of 5 patents)

14. William R Adams (5 out of 5 patents)

15. Ann S Williams (4 out of 4 patents)

Core Competencies:

Electroplating

Circuit Board Manufacturing

Corrosion Systems

Adhesion Techniques

Printed Circuit Boards

Photoresists

Tin Plating

Electroless Plating

Surface Treatment

Composition Methods

Solderability

Cleaning Processes

136 patents: Sort by Forward Citations

1. 12546020 - Electroplating bath for depositing chromium or chromium alloy and process for depositing chromium or chromium alloy (2026-02-10),

2. 12410525 - Multilayer corrosion system (2025-09-09),

3. 11913131 - Ternary zinc-nickel-iron alloys and alkaline electrolytes or plating such alloys (2024-02-27),

4. 6342332 - Liquid photoimagable resist which is resistant to blocking (2002-01-29),

5. 6281090 - Method for the manufacture of printed circuit boards with plated resistors (2001-08-28),

6. 6261381 - Composition and process for cleaning inks from various substrates including printing plates (2001-07-17),

7. 6217738 - Tin plating electrolyte compositions (2001-04-17),

8. 6214522 - Photosensitive resin composition useful in fabricating printing plates (2001-04-10),

9. 6206981 - Process for enhancing the adhesion of organic coatings to metal surfaces (2001-03-27),

10. 6200451 - Method for enhancing the solderability of a surface (2001-03-13),

11. 6197459 - Photosensitive resin composition useful in fabricating printing plates (2001-03-06),

12. 6168836 - Process for plating upon a polymeric surface (2001-01-02),

13. 6162503 - Process for improving the adhesion of polymeric materials to metal (2000-12-19),

14. 6146701 - Process for improving the adhension of polymeric materials to metal (2000-11-14),

15. 6132095 - Low friction sliding bearing for an axial shaft (2000-10-17),

Company Overview

Macdermid, Incorporated, headquartered in Waterbury, CT, specializes in advanced electroplating technology and related processes. The company focuses on developing innovative solutions for circuit board manufacturing, including corrosion systems, adhesion techniques, and photoresists. With expertise in tin plating and electroless plating, Macdermid serves a diverse range of industries, providing essential materials and technologies that enhance the performance and reliability of electronic components and systems.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

136 Patents

#1 in Waterbury, CT

#84 in Connecticut

#2,859 in US

#5,952 in the World

Waterbury, CT, United States of America

Macdermid, Incorporated

Forward Citations = 2,117

104 inventors:

Peter E Kukanskis (32 out of 46 patents)

Donald R Ferrier (25 out of 33 patents)

Gary B Larson (20 out of 24 patents)

4. Raymond A Letize (12 out of 14 patents)

5. John L Cordani (12 out of 12 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Macdermid, Incorporated. Retrieved from https://idiyas.com/company/macdermid

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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