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For the Inventor, By the Inventor

Waterbury, CT, United States of America

Macdermid, Incorporated


USPTO Granted Patents = 136



Trademarks = 35

Forward Citations = 2,115

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104 inventors (with patents filed for the assignee):

goldMedal Peter E Kukanskis (32 out of 46 patents)

silverMedal Donald R Ferrier (25 out of 33 patents)

bronzeMedal Gary B Larson (20 out of 24 patents)

4.  Raymond A Letize (12 out of 14 patents)

5.  John L Cordani (12 out of 12 patents)

6.  John J Grunwald (11 out of 11 patents)

7.  Eric Yakobson (7 out of 7 patents)

8.  John J Grunwald (6 out of 7 patents)

9.  Bryan Whitmore (6 out of 6 patents)

10.  Steven A Castaldi (5 out of 20 patents)

11.  Jon E Bengston (5 out of 6 patents)

12.  Peter D Gabriele (5 out of 5 patents)

13.  Harold L Rhodenizer (5 out of 5 patents)

14.  William R Adams (5 out of 5 patents)

15.  Ann S Williams (4 out of 4 patents)


Core Competencies:
Electroplating
Circuit Board Manufacturing
Corrosion Systems
Adhesion Techniques
Printed Circuit Boards
Photoresists
Tin Plating
Electroless Plating
Surface Treatment
Composition Methods
Solderability
Cleaning Processes

136 patents:

1. 12546020 - Electroplating bath for depositing chromium or chromium alloy and process for depositing chromium or chromium alloy (2026-02-10),
2. 12410525 - Multilayer corrosion system (2025-09-09),
3. 11913131 - Ternary zinc-nickel-iron alloys and alkaline electrolytes or plating such alloys (2024-02-27),
4. 6342332 - Liquid photoimagable resist which is resistant to blocking (2002-01-29),
5. 6281090 - Method for the manufacture of printed circuit boards with plated resistors (2001-08-28),
6. 6261381 - Composition and process for cleaning inks from various substrates including printing plates (2001-07-17),
7. 6217738 - Tin plating electrolyte compositions (2001-04-17),
8. 6214522 - Photosensitive resin composition useful in fabricating printing plates (2001-04-10),
9. 6206981 - Process for enhancing the adhesion of organic coatings to metal surfaces (2001-03-27),
10. 6200451 - Method for enhancing the solderability of a surface (2001-03-13),
11. 6197459 - Photosensitive resin composition useful in fabricating printing plates (2001-03-06),
12. 6168836 - Process for plating upon a polymeric surface (2001-01-02),
13. 6162503 - Process for improving the adhesion of polymeric materials to metal (2000-12-19),
14. 6146701 - Process for improving the adhension of polymeric materials to metal (2000-11-14),
15. 6132095 - Low friction sliding bearing for an axial shaft (2000-10-17),
Macdermid, Incorporated, headquartered in Waterbury, CT, specializes in advanced electroplating technology and related processes. The company focuses on developing innovative solutions for circuit board manufacturing, including corrosion systems, adhesion techniques, and photoresists. With expertise in tin plating and electroless plating, Macdermid serves a diverse range of industries, providing essential materials and technologies that enhance the performance and reliability of electronic components and systems.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

Macdermid, Incorporated
136 Patents

#1 in Waterbury, CT

#84 in Connecticut

#2,851 in US

#5,940 in the World

Waterbury, CT (US)
Waterbury, CT, United States of America

Macdermid, Incorporated

Forward Citations = 2,115

104 inventors:

goldMedal Peter E Kukanskis (32 out of 46 patents)

silverMedal Donald R Ferrier (25 out of 33 patents)

bronzeMedal Gary B Larson (20 out of 24 patents)

4.  Raymond A Letize (12 out of 14 patents)

5.  John L Cordani (12 out of 12 patents)

Please report any incorrect information to [email protected]
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