Edward E Cooney, Iii

Title: Edward E. Cooney, III: Innovator in Integrated Circuit Technology

Introduction

Edward E. Cooney, III is a notable inventor based in Jericho, Vermont, who has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, his work focuses on improving the efficiency and performance of metallization layers in integrated circuits.

Latest Patents

One of his latest patents involves a method for creating a copper to aluminum interlayer interconnect using tungsten studs. These studs are comparable in size to vias and serve to integrate and interface between copper and aluminum metallization layers in an integrated circuit. The patent outlines a process that includes lining a via opening with layers of tantalum nitride and PVD tungsten, which acts as a barrier against the corrosive effects of tungsten fluoride on copper. This innovative approach allows for the formation of wiring and connection pads in a single aluminum layer, thereby enhancing performance while reducing process time and costs.

Career Highlights

Edward E. Cooney, III is currently employed at International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies in the field of electronics. His work has been instrumental in advancing the capabilities of integrated circuits, making them more efficient and reliable.

Collaborations

Throughout his career, Cooney has collaborated with esteemed colleagues such as Lloyd G. Burrell and Jeffrey P. Gambino. These partnerships have contributed to the successful development of his innovative technologies.

Conclusion

Edward E. Cooney, III stands out as a significant figure in the realm of integrated circuit technology, with his patents reflecting a commitment to innovation and efficiency. His contributions continue to shape the future of electronics.