Growing community of inventors

Jericho, VT, United States of America

Edward E Cooney, Iii

Average Co-Inventor Count = 12.00

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 4

Edward E Cooney, IiiAnthony K Stamper (2 patents)Edward E Cooney, IiiJeffrey P Gambino (2 patents)Edward E Cooney, IiiBaozhen Li (2 patents)Edward E Cooney, IiiHyun K Lee (2 patents)Edward E Cooney, IiiStephen Ellinwood Luce (2 patents)Edward E Cooney, IiiKwong Hon Wong (2 patents)Edward E Cooney, IiiThomas L McDevitt (2 patents)Edward E Cooney, IiiLloyd G Burrell (2 patents)Edward E Cooney, IiiJohn E Heidenreich, Iii (2 patents)Edward E Cooney, IiiMark D Levy (2 patents)Edward E Cooney, IiiSally J Yankee (2 patents)Edward E Cooney, IiiEdward E Cooney, Iii (2 patents)Anthony K StamperAnthony K Stamper (633 patents)Jeffrey P GambinoJeffrey P Gambino (584 patents)Baozhen LiBaozhen Li (158 patents)Hyun K LeeHyun K Lee (87 patents)Stephen Ellinwood LuceStephen Ellinwood Luce (67 patents)Kwong Hon WongKwong Hon Wong (61 patents)Thomas L McDevittThomas L McDevitt (60 patents)Lloyd G BurrellLloyd G Burrell (10 patents)John E Heidenreich, IiiJohn E Heidenreich, Iii (10 patents)Mark D LevyMark D Levy (8 patents)Sally J YankeeSally J Yankee (7 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (2 from 164,108 patents)


2 patents:

1. 7087997 - Copper to aluminum interlayer interconnect using stud and via liner

2. 7037824 - Copper to aluminum interlayer interconnect using stud and via liner

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as of
12/3/2025
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