This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Eberhard Dengler: Innovator in Wafer Probe Alignment Technology
Introduction
Eberhard Dengler is a notable inventor based in Böblingen, Germany. He has made significant contributions to the field of semiconductor testing, particularly in the area of wafer probe alignment. With a total of 3 patents to his name, Dengler's work has had a substantial impact on the efficiency and accuracy of chip testing processes.
Latest Patents
One of Eberhard Dengler's latest patents focuses on a wafer probe alignment system and method. This innovative system is designed for aligning a probe to a chip wafer for testing a chip on the wafer. The method allows for at least two corners of the probe to be adjustable in the same direction relative to a primary corner of the probe. The alignment approach includes providing a grid of signal pins that correspond to the contact pads of the chip under test. It determines whether an electrical contact is established to a corresponding contact pad of the chip under contact force. The system then adjusts the position of each of the at least two corners by a corner individual delta position value, depending on the results of the determining process. This ensures that an electrical contact is established between each of the pins and the corresponding contact pads of the chip under test.
Career Highlights
Eberhard Dengler has built a successful career at the International Business Machines Corporation (IBM). His work has been instrumental in advancing technologies that enhance the testing of semiconductor devices. His innovative approaches have contributed to the efficiency and reliability of chip testing methodologies.
Collaborations
Dengler has collaborated with several talented individuals in his field, including Gabriele Kuczera and Siegfried Tomaschko. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in wafer probe alignment.
Conclusion
Eberhard Dengler's contributions to wafer probe alignment technology exemplify his dedication to innovation in the semiconductor industry. His patents and collaborative efforts continue to influence the field, ensuring more efficient and accurate testing processes for chip manufacturers.