Company Filing History:
Years Active: 2001-2006
Title: Profile of Inventor Eberhard B Gramatzki
Introduction: Eberhard B Gramatzki is an accomplished inventor based in Essex Junction, Vermont, USA. With a total of three patents to his name, he has made significant contributions to the field of semiconductor technology. His innovative methods enhance the reliability and performance of electronic components, particularly in chip-to-chip connections.
Latest Patents: Among his notable inventions is the patent for "Extension of fatigue life for C4 solder ball to chip connection." This invention outlines a method and structure for effectively coupling a semiconductor substrate, such as a semiconductor chip, to an organic substrate, like a chip carrier. The invention ensures that the solder member, typically a solder ball, interfaces optimally with conductive pads on both the semiconductor and organic substrates. By manipulating the surface area of the solder pads and positioning, his method significantly reduces thermal strains during thermal cycling, thereby extending the operational lifespan of electronic components.
Career Highlights: Eberhard currently works at the International Business Machines Corporation (IBM), a leading entity in technology and innovation. His work involves rigorous research and development in semiconductor technologies, where he applies his expertise to foster advancements in electronic hardware.
Collaborations: Eberhard has closely collaborated with esteemed coworkers, including William E Bernier and Charles F Carey. Together, they have contributed to various projects that have pushed the boundaries of semiconductor design and manufacturing.
Conclusion: Eberhard B Gramatzki exemplifies the spirit of innovation in the semiconductor industry. His contributions not only demonstrate technical proficiency but also reflect a commitment to enhancing the durability and efficiency of modern electronics. Through his work at IBM and collaborations with fellow innovators, he continues to pave the way for future advancements in the field.