Earl Ryan Lory

Title: Earl Ryan Lory: Innovator in Semiconductor Fabrication

Introduction

Earl Ryan Lory is a notable inventor based in Pennington, NJ (US), recognized for his contributions to semiconductor fabrication technology. He holds a total of 5 patents, showcasing his innovative approach to solving complex challenges in the field.

Latest Patents

One of Lory's latest patents is titled "Active neural network control of wafer attributes in a plasma etch." This invention leverages the emission trace from a plasma glow used in integrated circuit fabrication to monitor and control variations in the fabrication process. By employing neural networks, Lory's method determines plasma etch end-point times based on in-situ monitoring of optical emission traces. This approach enhances the quality of the output product by regulating control variables and materials in the manufacturing process.

Another significant patent is "Low temperature deposition of silicon oxides for device fabrication." This process utilizes a plasma struck in a gas containing tetraethoxysilane and a source of oxygen to achieve conformal coatings of silicon dioxide at low temperatures. This innovation has substantial implications for semiconductor device fabrication, particularly in depositing dielectrics over metallic non-planar structures.

Career Highlights

Throughout his career, Lory has worked with prominent companies such as Lucent Technologies Inc. and AT&T Bell Laboratories. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Lory has collaborated with notable individuals in the field, including Leonard Jay Olmer and Robert Charles Frye. These partnerships have likely enriched his work and led to further advancements in semiconductor fabrication.

Conclusion

Earl Ryan Lory's contributions to semiconductor technology through his patents and career achievements highlight his role as an innovator in the field. His work continues to influence the industry and pave the way for future advancements in integrated circuit fabrication.