Company Filing History:
Years Active: 2022-2024
Title: Dusan Radovic: Innovator in Microelectromechanical Systems
Introduction
Dusan Radovic is a notable inventor based in Stuttgart, Germany. He has made significant contributions to the field of microelectromechanical systems (MEMS). With a total of two patents to his name, Radovic's work focuses on enhancing the functionality and accuracy of MEMS sensors.
Latest Patents
Radovic's latest patents include a "Method for temperature compensation of a microelectromechanical sensor" and a "Method and device for determining a feature for devices produced on a wafer." The first patent outlines a method that involves producing a temperature gradient through a thermal element. It details a balancing step where temperatures are measured at two points, and the deflection of a movable structure is assessed to ascertain a compensation value. This method ultimately allows for accurate measurement of physical stimuli by compensating for temperature variations. The second patent describes a computer-implemented method for inferring device features based on a wafer feature model, which is trained using wafer feature maps.
Career Highlights
Dusan Radovic is currently employed at Robert Bosch GmbH, a leading global supplier of technology and services. His work at Bosch involves the development of innovative solutions in the MEMS sector. His expertise in temperature compensation methods has positioned him as a key player in advancing sensor technology.
Collaborations
Radovic collaborates with talented colleagues such as Amin Jemili and Jochen Reinmuth. Their combined efforts contribute to the innovative projects at Robert Bosch GmbH, fostering a collaborative environment that drives technological advancements.
Conclusion
Dusan Radovic's contributions to the field of microelectromechanical systems are noteworthy. His innovative patents and collaborative work at Robert Bosch GmbH highlight his commitment to advancing sensor technology. His efforts continue to shape the future of MEMS applications.