The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Aug. 25, 2020
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Christoph Zimmer, Korntal, DE;

Dusan Radovic, Stuttgart, DE;

Eric Sebastian Schmidt, Heimsheim, DE;

Matthias Kuehnel, Boeblingen, DE;

Michael Herman, Sindelfingen, DE;

Wenqing Liu, Weil der Stadt, DE;

Jan Martin Lubisch, Ponn, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/66 (2006.01); G06N 20/00 (2019.01); G05B 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G05B 13/04 (2013.01); G06N 20/00 (2019.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G06F 2101/14 (2013.01);
Abstract

A computer-implemented method for inferring a device feature of a device produced on a wafer. The method includes: providing a wafer feature model associating a wafer position indicating a position of a produced device on the wafer to a device feature, wherein the wafer feature model is configured to be trained by one or more wafer feature maps and particularly configured as a Gaussian process model, providing a sample device feature of at least one device at a sample wafer position, and inferring the device feature of at least one other device of the wafer depending on the provided wafer feature model.


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