Kunshan, China

Duo Yang

This inventor holds 6 USPTO granted patents. Top assignees: Foxconn Interconnect Technology Limited, Foxconn (Kunshan) Computer Connector Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Duo Yang. Retrieved from https://idiyas.com/inventor/duo-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2016-2025

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6 patents (USPTO):Explore Patents

Title: Duo Yang: Innovator in Connector Technology

Introduction

Duo Yang is a prominent inventor based in Kunshan, China. He has made significant contributions to the field of connector technology, holding a total of 6 patents. His work has been instrumental in advancing the capabilities and efficiency of various connector systems.

Latest Patents

Among his latest innovations, Duo Yang has developed a new type of connector that enhances performance and reliability. This invention showcases his commitment to improving technology in the interconnect industry.

Career Highlights

Duo Yang has worked with notable companies such as Foxconn Interconnect Technology Limited and Foxconn (Kunshan) Computer Connector Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects.

Collaborations

Duo has collaborated with talented individuals in his field, including Jing Lu and Jiang Zhang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Duo Yang's contributions to connector technology and his impressive portfolio of patents highlight his role as a leading inventor in the industry. His work continues to influence advancements in technology and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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