Duksung Kim

Title: Duksung Kim: Innovator in Die-to-Die Interconnect Technology

Introduction

Duksung Kim is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor technology, particularly in the area of die-to-die interconnects. His innovative work has led to advancements that enhance the performance and efficiency of integrated circuits.

Latest Patents

Duksung Kim holds a patent for an "Apparatus and method for die-to-die (D2D) interconnects." This invention includes a first die connected to a second die through a die-to-die interface. The first die features a first interconnect that provides lanes for communication with the second die. It also includes a logic circuit that indicates the correlation between the number of chiplet dies connected to the first lanes and the connected signal pins. The second die comprises multiple connected chiplet dies, each equipped with a second interconnect that facilitates communication to the D2D interface.

Career Highlights

Duksung Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has significantly contributed to the development of advanced interconnect solutions that are crucial for modern electronic devices.

Collaborations

Throughout his career, Duksung Kim has collaborated with notable colleagues, including Wangyong Im and Byoungkon Jo. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Duksung Kim's contributions to die-to-die interconnect technology exemplify his commitment to advancing semiconductor innovation. His patent and ongoing work at Samsung Electronics Co., Ltd. highlight his role as a key player in the field.