The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Oct. 31, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Wangyong Im, Suwon-si, KR;
Byoungkon Jo, Suwon-si, KR;
Gyesik Oh, Suwon-si, KR;
Duksung Kim, Suwon-si, KR;
Jangseok Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
An apparatus includes a first die connected to a second die through a die-to-die (D2D) interface. The first die includes a first interconnect configured to provide first lanes communicating with the second die to the D2D interface, the first interconnect includes a first logic circuit configured to indicate a correlation between a number of chiplet dies connected to the first lanes and connected signal pins from among a plurality of signal pins of the connected chiplet dies. The second die includes the number of connected chiplet dies each including a second interconnect configured to provide second lanes to the D2D interface from each of the connected chiplet dies. The second lanes are configured to be set according to a number of the connected signal pins of the connected chiplet dies.