Suwon, South Korea

Duk Hyun Chun

This inventor holds 6 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2016-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Duk Hyun Chun. Retrieved from https://idiyas.com/inventor/duk-hyun-chun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Gyunggi-do, KR (2016)
  • Suwon-si, KR (2018 - 2024)

Company Filing History:


Years Active: 2016-2024

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6 patents (USPTO):Explore Patents

Title: The Innovations of Duk Hyun Chun

Introduction

Duk Hyun Chun is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronic components, holding a total of six patents. His work focuses on enhancing the reliability and efficiency of multilayer electronic components.

Latest Patents

Among his latest patents is a multilayer electronic component designed to improve moisture resistance. This innovation allows for the external electrode to be thinned, thereby securing capacitance per unit volume. Additionally, it ensures that the external electrode maintains a specific thickness or higher at the corners, which enhances its reliability.

Career Highlights

Duk Hyun Chun is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in electronic components. His expertise in multilayer structures has positioned him as a key player in the industry.

Collaborations

Some of his notable coworkers include Myung Jun Park and Hyun Hee Gu, who collaborate with him on various projects within the company.

Conclusion

Duk Hyun Chun's innovative work in multilayer electronic components showcases his commitment to advancing technology in the electronics field. His contributions are vital for improving the performance and reliability of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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