The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Jan. 17, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jin Soo Park, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
Hyun Hee Gu, Suwon-si, KR;
Bum Soo Kim, Suwon-si, KR;
Yeon Song Kang, Suwon-si, KR;
Duk Hyun Chun, Suwon-si, KR;
Chung Eun Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/008 (2013.01); H01G 4/248 (2013.01); H01G 4/308 (2013.01); H01G 4/1227 (2013.01);
Abstract
A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.