Duay Ing Ong

Title: Duay Ing Ong: Innovator in Semiconductor Packaging

Introduction

Duay Ing Ong is a notable inventor based in Kluang, Johor, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a method of vacuum packaging a semiconductor device assembly. This invention involves a semiconductor chip device package that consists of a semiconductor substrate with semiconductor devices formed on it. At least one dielectric layer is placed over the semiconductor substrate, and at least one layer of interconnects is positioned over the semiconductor devices. These interconnects are separated by voids containing a vacuum or air. A passivation layer is applied over the uppermost layer of interconnects, ensuring that the semiconductor chip device is vacuum sealed within the package.

Career Highlights

Duay Ing Ong is currently associated with Chartered Semiconductor Manufacturing Ltd, a corporation known for its advancements in semiconductor technology. His work has been instrumental in enhancing the efficiency and reliability of semiconductor devices.

Collaborations

He has collaborated with notable colleagues such as Shyue-Fong Quek and Ting Cheong Ang, contributing to various projects that push the boundaries of semiconductor innovation.

Conclusion

Duay Ing Ong's contributions to semiconductor packaging reflect his dedication to innovation and technology. His patents not only advance the field but also demonstrate the importance of collaboration in achieving groundbreaking results.