Duane A Stanke

Title: Duane A. Stanke: Innovator in Printed Circuit Board Technology

Introduction

Duane A. Stanke is a notable inventor based in Newark Valley, NY (US). He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique method that enhances the functionality and reliability of circuit boards.

Latest Patents

Duane holds a patent for a "Method of providing a printed circuit board with an edge connection portion." This patent describes a method of making a printed circuit board where at least two circuitized substrates are aligned and bonded together, typically through lamination. A gasket is utilized on one substrate, while a facing circuitized portion is applied to the other. This gasket effectively seals the circuitized portion, preventing heated dielectric material from contacting the circuitry. After the bonding process, parts of the bonded structure, including the gasket, are removed to create a projecting edge portion with circuitry. This edge portion is designed to fit within an edge connector. Duane has 1 patent to his name.

Career Highlights

Duane is currently employed at Endicott Interconnect Technologies, Inc., where he continues to innovate in the field of circuit board technology. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and reliable for various applications.

Collaborations

Throughout his career, Duane has collaborated with talented individuals such as Robert J. Testa and Thomas R. Miller. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Duane A. Stanke is a distinguished inventor whose contributions to printed circuit board technology have made a lasting impact. His innovative methods and collaborative spirit continue to drive advancements in the industry.