Doyle E Beaty, Jr

Title: The Innovations of Doyle E Beaty, Jr.

Introduction

Doyle E Beaty, Jr. is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent that enhances circuit density.

Latest Patents

Doyle E Beaty, Jr. holds a patent for a VLSI integrated circuit having parallel bonding areas. This invention provides a very large scale multicell integrated circuit with significantly improved circuit density. Both active and passive circuit elements are formed in a semiconductor substrate using ordinary diffusion techniques. Connectors, preferably made of polysilicon material, are then formed on the surface of the substrate. The connectors have bonding pad areas located along predetermined lines where metal connectors of later-formed metallization layers can be located. Some of the connectors have bonding pad areas connected to circuit elements while others are left unconnected. The subsequently formed metallization layers can then be used to connect together various ones of the circuit elements and multiple ones of the cells together in any desired circuit configuration using the polysilicon connectors.

Career Highlights

Doyle E Beaty, Jr. is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to be at the forefront of technological advancements in integrated circuits.

Collaborations

Throughout his career, Doyle has collaborated with notable colleagues such as Haluk O Askin and Joseph R Cavaliere. These collaborations have contributed to the development of innovative technologies in the field.

Conclusion

Doyle E Beaty, Jr. is a distinguished inventor whose work in VLSI integrated circuits has made a lasting impact on the industry. His contributions continue to influence advancements in technology and circuit design.