The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1988
Filed:
Mar. 18, 1986
Haluk O Askin, Clinton Corners, NY (US);
Doyle E Beaty, Jr, Wappingers Falls, NY (US);
Joseph R Cavaliere, Hopewell Junction, NY (US);
Guy Rabbat, Wappingers Falls, NY (US);
John Balyoz, Hopewell Junction, NY (US);
Achilles A Sarris, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A very large scale multicell integrated circuit is provided with significantly improved circuit density. Both active and passive circuit elements are formed in a semiconductor substrate using ordinary diffusion techniques. Connectors, preferably made of polysilicon material, are then formed on the surface of the substrate. The connectors have bonding pad areas located along predetermined lines where metal connectors of later-formed metallization layers can be located. Some of the connectors have bonding pad areas connected to circuit elements while others are left unconnected. The subsequently formed metallization layers can then be used to connect together various ones of the circuit elements and multiple ones of the cells together in any desired circuit configuration using the polysilicon connectors.