Boise, ID, United States of America

Douglas R Hackler, Sr

USPTO Granted Patents = 17 

Average Co-Inventor Count = 2.1

ph-index = 8

Forward Citations = 199(Granted Patents)


Company Filing History:


Years Active: 2005-2023

where 'Filed Patents' based on already Granted Patents

17 patents (USPTO):

Title: **Innovations by Douglas R Hackler, Sr: Pioneering Advances in Semiconductor Technology**

Introduction

Douglas R Hackler, Sr, an influential inventor based in Boise, ID, has made remarkable contributions to the field of semiconductor technology. With a total of 17 patents to his name, Hackler continues to push the boundaries of innovation through his inventive work at American Semiconductor Corporation.

Latest Patents

Two of his latest patents highlight his expertise and ingenuity. The first, titled "Method of Demounting Thin Semiconductor Devices," presents a novel technique for the removal of flexible materials from temporary carriers. This method allows semiconductor wafers, often adhered to a temporary substrate during processing, to be transferred smoothly to new surfaces. The process employs a series of rollers that peel the ultra-thin device layer from the temporary adhesive, eliminating the need for complex laser release or chemical removal methods. This innovative approach supports orientation changes without compromising the integrity of the thinned wafer.

The second patent, "Flexible Micro-Module," leverages ultra-thin flexible single crystalline integrated circuits (ICs) to create a compact device. This flexible micro-module integrates various components—including ICs, insulating substrates, and external contacts—into a single device. This innovation greatly improves smart card assemblies, allowing for the use of larger ICs and eliminating the requirement for wire bonds, thereby enhancing overall efficiency in the manufacturing process.

Career Highlights

Throughout his career, Douglas R Hackler, Sr has established himself as a leading figure in semiconductor innovations. His work has not only resulted in a significant number of patents but has also shifted industry standards towards more efficient manufacturing techniques. His commitment to innovation is evident in the practical applications of his patented methods.

Collaborations

Hackler collaborates closely with notable colleagues, including Stephen A Parke and Dale G Wilson. Together, they contribute to the mission of American Semiconductor Corporation, fostering an environment of creativity and teamwork that has led to groundbreaking advancements in the field.

Conclusion

Douglas R Hackler, Sr's contributions to the world of semiconductor technology are invaluable. With his innovative patents, dedicated career, and effective collaborations, he plays a crucial role in advancing the capabilities and applications of semiconductor devices. As he continues to innovate, the industry can anticipate further groundbreaking developments that will enhance technology as we know it.

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