The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jun. 08, 2018
Applicant:
Douglas R. Hackler, Sr., Boise, ID (US);
Inventor:
Douglas R. Hackler, Sr., Boise, ID (US);
Assignee:
American Semiconductor, Inc., Boise, ID (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5388 (2013.01); H01L 23/13 (2013.01); H01L 23/49883 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32235 (2013.01); H01L 2924/0665 (2013.01);
Abstract
The described Flexible Micro-Module (FMM) is a device that is made possible by the application of ultra-thin flexible single crystalline ICs. The FMM integrates the IC(s), insulating contact substrate, vias for connections to pads, and external contacts into a single device. The thin and flexible FMM eliminates the need for wire bonds and card body cavities in smart card assemblies, and accommodates applying larger ICs to smart cards than what is possible with conventional micro-modules.