Doo Yun Chung

Title: The Innovative Contributions of Doo Yun Chung

Introduction

Doo Yun Chung is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of technology, particularly in the development of advanced probe cards. His innovative approach has led to the creation of a unique patent that addresses common challenges in the industry.

Latest Patents

Doo Yun Chung holds a patent for a "Probe card having lead part for removing excessive solder." This invention includes a ceramic substrate and an electrode connection part that connects an electrode pad and a via pad on one surface of the ceramic substrate. The design features a bonding pad on the upper surface of the electrode pad, which is positioned inwardly of the edge of the electrode pad. A probe is bonded to the bonding pad's upper surface by a solder layer. Notably, the bonding pad includes a lead part that protrudes from its side surface, allowing overflowed solder during the probe attachment process to be dispersed to the lead part.

Career Highlights

Doo Yun Chung is associated with Semcns Co., Ltd., where he continues to innovate and contribute to the field. His work has been instrumental in enhancing the functionality and reliability of probe cards, which are essential in semiconductor testing.

Collaborations

Doo Yun Chung collaborates with talented individuals such as Yong Seok Choi and Dae Hyeong Lee. Their combined expertise fosters a creative environment that drives innovation and technological advancement.

Conclusion

Doo Yun Chung's contributions to the field of technology through his patent and collaborative efforts highlight his role as a significant inventor. His work not only addresses existing challenges but also paves the way for future innovations in semiconductor technology.