The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Nov. 06, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd, Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Yong Seok Choi, Suwon-Si, KR;

Doo Yun Chung, Suwon-Si, KR;

Dae Hyeong Lee, Suwon-Si, KR;

Assignee:

SEMCNS CO., LTD., Seongnam-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07307 (2013.01); G01R 3/00 (2013.01);
Abstract

A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.


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