This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2014-2016.
Location History:
- Chungcheongnam-do, KR (2014)
- Yeongi-gun, KR (2016)
Company Filing History:
Years Active: 2014-2016
Title: The Innovations of Doo Pyo Hong
Introduction: Doo Pyo Hong is a notable inventor based in Yeongi, South Korea. He has made significant contributions to the field of printed circuit board technology. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents: One of his latest patents is a method of manufacturing a rigid-flexible printed circuit board. This method involves providing a base substrate where coverlays are formed on both sides of a flexible copper foil laminate. The process includes layering insulation and copper foil layers on portions of the coverlays designated as rigid regions. Additionally, it involves forming via holes in both the rigid and flexible regions, creating outer circuit patterns, and applying solder resists to expose portions of the external circuit patterns. Another patent focuses on a similar method, emphasizing the formation of first windows in the coverlays and ensuring that the outer circuit patterns include additional plating portions for covering the coverlays.
Career Highlights: Doo Pyo Hong is currently employed at Samsung Electro-Mechanics Co., Ltd. His work at this leading company has allowed him to develop innovative solutions in the realm of electronics and circuit board manufacturing.
Collaborations: Throughout his career, he has collaborated with notable colleagues such as Going Sik Kim and Yang Je Lee. These collaborations have further enhanced his contributions to the field.
Conclusion: Doo Pyo Hong's innovative methods in manufacturing rigid-flexible printed circuit boards demonstrate his expertise and commitment to advancing technology. His patents reflect a deep understanding of the complexities involved in circuit board design and manufacturing.