Vestal, NY, United States of America

Donna Jean Trevitt


Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 115(Granted Patents)


Company Filing History:


Years Active: 1984-2001

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8 patents (USPTO):Explore Patents

Title: The Innovations of Donna Jean Trevitt

Introduction

Donna Jean Trevitt is a notable inventor based in Vestal, NY (US). She has made significant contributions to the field of integrated circuit packaging, holding a total of 8 patents. Her work focuses on improving the bond strength between semiconductor chips and metal heat sinks, which is crucial for the performance and reliability of electronic devices.

Latest Patents

Among her latest patents, one notable invention is an integrated circuit package that enhances the bond strength between a semiconductor chip and a metal heat sink. This is achieved through an innovative adhesive system that comprises two separate layers. One layer exhibits preferential bonding strength for the chip, while the other layer is designed for the metal heat sink. This dual-layer approach significantly improves the overall performance of the integrated circuit package.

Another recent patent by Trevitt also addresses the bond strength in integrated circuit packages, utilizing a similar adhesive system to achieve optimal results. Her inventions are paving the way for advancements in electronic packaging technology.

Career Highlights

Donna Jean Trevitt has built a successful career at International Business Machines Corporation (IBM). Her expertise in integrated circuit technology has made her a valuable asset to the company. Trevitt's innovative spirit and dedication to her work have led to numerous advancements in the field.

Collaborations

Throughout her career, Trevitt has collaborated with talented individuals such as Voya Rista Markovich and Carlos Juan Sambucetti. These collaborations have fostered a creative environment that encourages innovation and the development of groundbreaking technologies.

Conclusion

Donna Jean Trevitt's contributions to the field of integrated circuit packaging are noteworthy and impactful. Her innovative patents and collaborations highlight her commitment to advancing technology in the electronics industry. Her work continues to inspire future inventors and engineers.

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