International Business Machines Corporation

Donna Jean Trevitt

Voya Rista Markovich

Carlos Juan Sambucetti

David L Questad

Stephen L Tisdale

Edmond Otto Fey

George Henry Thiel

Tien Y Wu

William J Amelio

Patrick Robert Zippetelli

Gary K Lemon

Kenneth Stanley Lyjak

Anne Marie Quinn

James Russell Bupp

David E King

Theodore Panasik

The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.

Integrated circuit package

Integrated circuit package including a heat sink and an adhesive

A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.

Method of controlling the spread of an adhesive on a circuitized organic

A process for monitoring an electroless plating bath to determine whether it is in a take mode by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode; providing the cathode, a reference electrode, and an anode in the electroless bath; passing an electric current and varying the voltage difference, plotting the voltage difference versus the current; and comparing the oxidation peak of the reducing agent to the oxidation peak of the reduced state of the metal ion to be plated to thereby determine whether the bath is in a take mode.

Process for determining the plating activity of an electroless plating

Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl. The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.

Method for conditioning a surface of a dielectric substrate for

An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:

Method for providing an electroless copper plating bath in the take mode

Multistep process for electroless plating of copper onto a non-conductive surface including the steps of: (1) laminating a rough copper sheet onto the non-conductive surface; (2) etching away all the copper; (3) conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; (4) activating the conditioned surface preferably with stannous/palladium chloride particles; (5) treating the activated surface with deionized water and diluted HCl; (6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and (7) plating copper using successively two baths differing in their oxygen and CN.sup.- concentration, where the foregoing steps are interspersed with washing steps.

Method for selective electroless plating of copper onto a non-conductive

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Vestal, NY, United States of America

Donna Jean Trevitt