The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 1984
Filed:
Oct. 11, 1983
William J Amelio, Binghamton, NY (US);
Gary K Lemon, Endwell, NY (US);
Voya Markovich, Endwell, NY (US);
Theodore Panasik, Vestal, NY (US);
Carlos J Sambucetti, Croton-on-Hudson, NY (US);
Donna J Trevitt, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Multistep process for electroless plating of copper onto a non-conductive surface including the steps of: (1) laminating a rough copper sheet onto the non-conductive surface; (2) etching away all the copper; (3) conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; (4) activating the conditioned surface preferably with stannous/palladium chloride particles; (5) treating the activated surface with deionized water and diluted HCl; (6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and (7) plating copper using successively two baths differing in their oxygen and CN.sup.- concentration, where the foregoing steps are interspersed with washing steps.