Suwon-si, South Korea

Dongok Kwak

This inventor holds 1 USPTO granted patent and 8 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongok Kwak. Retrieved from https://idiyas.com/inventor/dongok-kwak-85b6kneo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Dongok Kwak

Introduction

Dongok Kwak is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor technology. His innovative work has led to the development of a unique stacked semiconductor package.

Latest Patents

Dongok Kwak holds 1 patent for his invention of a stacked semiconductor package. This package includes a base substrate and multiple semiconductor chips arranged in a stacked configuration. The design features a first chip stack and a second chip stack, with bonding wires that connect the chips to the base substrate. The arrangement allows for a step shape in the chips, enhancing the overall efficiency and functionality of the semiconductor package.

Career Highlights

Kwak is currently employed at Samsung Electronics Ltd., a leading company in the electronics industry. His work at Samsung has positioned him as a key player in advancing semiconductor technologies. His innovative designs contribute significantly to the company's product offerings and technological advancements.

Collaborations

Dongok Kwak has collaborated with notable colleagues, including Joonghyun Baek and Jaekyu Sung. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Dongok Kwak's contributions to semiconductor technology exemplify the spirit of innovation. His patent for a stacked semiconductor package showcases his ability to create efficient and effective solutions in the electronics field. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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