The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jun. 13, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Joonghyun Baek, Suwon-si, KR;
Jaekyu Sung, Suwon-si, KR;
Dongok Kwak, Suwon-si, KR;
Taeyoung Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A stacked semiconductor package may include a package base substrate, a first chip stack including a first semiconductor chips stacked sequentially on the package base substrate, a second chip stack including second semiconductor chips stacked sequentially on the first chip stack, and bonding wires electrically connecting the first semiconductor chips and the second semiconductor chips to the package base substrate. Each of the first semiconductor chips may be shifted by a first interval in a first horizontal direction to have a step shape. Each of the second semiconductor chips may be shifted by the first interval in a second horizontal direction, opposite to the first horizontal direction, to have a step shape. A lowermost second semiconductor chip may be shifted from an uppermost first semiconductor chip by a second interval in the second direction. The second interval may be greater than the first interval.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile