Location History:
- Pyeongtaek-si, KR (2021)
- Seoul, KR (2023 - 2024)
Company Filing History:
Years Active: 2021-2024
Title: The Innovative Contributions of Dongjoo Choi
Introduction
Dongjoo Choi is a prominent inventor based in Pyeongtaek-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in developing advanced semiconductor packages.
Latest Patents
Dongjoo Choi's latest patents focus on innovative semiconductor package designs. One of his notable inventions includes a semiconductor package that features an interposer substrate, an upper semiconductor chip, and a chip stack comprising multiple lower semiconductor chips. This design allows for efficient electrical connections through the interposer substrate to the through vias. Another patent describes a semiconductor package that includes a lower semiconductor chip with a protective layer, along with an upper semiconductor chip that has a wiring structure and multiple signal and thermal vias. These inventions showcase his expertise in enhancing semiconductor performance and reliability.
Career Highlights
Throughout his career, Dongjoo Choi has been recognized for his innovative approach to semiconductor packaging. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing. Working at Samsung Electronics Co., Ltd. has provided him with the platform to push the boundaries of technology and contribute to the advancement of the industry.
Collaborations
Dongjoo Choi has collaborated with several talented individuals in his field, including Seungduk Baek and Youngdeuk Kim. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Dongjoo Choi's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor packaging, making significant strides in innovation and technology.