The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Nov. 20, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided is a semiconductor package including a lower semiconductor chip including a lower semiconductor substrate, a rear surface protecting layer covering a non-active surface of the lower semiconductor substrate, a plurality of lower via electrodes, and a plurality of rear surface signal pads and a plurality of rear surface thermal pads arranged on the rear surface protecting layer; an upper semiconductor chip including an upper semiconductor substrate, a wiring structure on an active surface of the upper semiconductor substrate, a front surface protecting layer that covers the wiring structure and has a plurality of front surface openings, and a plurality of signal vias and a plurality of thermal vias that fill the front surface openings; and a plurality of signal bumps connecting between the rear surface signal pads and the signal vias and a plurality of thermal bumps connecting between the rear surface thermal pads and the thermal vias.