The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jun. 08, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongjoo Choi, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Semiconductor chips may include a substrate; a protective layer on a first surface of the substrate, through electrodes extending through the substrate and the protective layer, and a Peltier structure including first through structures including first conductivity type impurities, and second through structures including second conductivity type impurities, which may extend through the substrate and the protective layer; pads on the protective layer and connected to the through electrodes, respectively, first connection wires connecting respective first ends of the first through structures to respective first ends of the second through structures, and second connection wires connecting respective second ends of the first through structures to respective second ends of one of the second through structures. The first through structures and the second through structures may be alternately connected to each other in series by the first connection wires and the second connection wires.